3D SPI Solder Paste Inspection Machine For SMT PCB Printing Quality Control

• Programmable Phase Modulation Profile Measurement Technology (PSLM PMP): Patented invention, the original programmable structure grating can set the grating period using software; the mechanical drive and transmission parts are eliminated,which greatly improves the accuracy and application range of the equipment, avoids mechanical wear and maintenance costs, and achieves 100% high-precision three-dimensional measurement of precision printed solder paste in SMT production lines.
• The independently developed patented synchronous structured light technology solves the shadow effect interference in the three-dimensional detection of solder paste. Combined with the RG two-dimensional light source, it perfectly handles high-contrast substrates, such as black substrates, ceramic substrates, etc. Using red, blue and green light, it can provide color 2D images;
• High-resolution image processing system: The ultra-high frame rate 5-megapixel industrial CCD camera, combined with high-end lenses, supports fast and stable detection of 0201 solder paste. It also provides a variety of different resolutions such as 13um, 16um, and 20um to meet customers' product diversity and detection speed requirements;
• Fast Gerber import and programming software, which can achieve the fastest 5-minute programming in the industry; the manual teach function facilitates users to program and test when there is no Gerber data;
• Z-axis real-time dynamic profiling: The PSLM feature provides real-time dynamic tracking of PCB warping changes, perfectly solving the warping problem of flexible circuit boards and PCBs.
• Powerful process statistical analysis function (SPC): Real-time SPC information display and complete and diverse SPC tools allow users to monitor production problems in real time and reduce defects caused by poor solder paste printing. Provide operators with strong quality control support, allowing users to see at a glance;
• The repeatability of the equipment is <<10% (4Sigma).

 Model

 ET-SPIS8080

 Measurement Principle

 3D White Light PSLM PMP (Programmable Grating Phase Modulation Profilometry )

 Measurements

 volume，acreage，height， XY offset, shape

 Detection of Non-performing Types

 missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination

 Lens Resolution

 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um (optional for different camera models)

 Accuracy

 XY (Resolution)：10μm

 Repeatability

 height：≤1μm （4 Sigma）;volume/area：<1%（4 Sigma）;

 Gage R&R

 <<10%

 Inspection Speed

 0.35sec/FOV-0.5sec/FOV (determined by actual configuration)

 Quality of Inspection Head

 Standard 1pcs, optional 2pcs, 3pcs

 Mark-point Detection Time

 0.3sec/piece

 Maximum Detection Height

 ±550um (±1200um as option)

 Minimum Pad Spacing

 100um (pad height is 150um pad as reference) 80um/100um/150um/200um (determined according to actual configuration)

 Maximum measurement height of bent PCB

 ±5mm

 Minimum Component

 01005/03015/008004(optional)

 Maximum Loading PCB & Detection Size(X*Y)

 450x500mm

 Fixed rail setting

 Front orbit (back orbit as option)

 PCB Transfer Direction

 Left to right or Right to left

 Conveyor Width Adjustment

 manual & automatic

 SPC/Engineering Statistics

 Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；SPI Daily/Weekly/Monthly Reports

 Gerber & CAD Data Import

 support Gerber format（274x，274d）,manual Teach model)；CAD X/Y，Part No.，Package Type input)

 Operating System Support

 Windows 10 Professional （64 bit）

 Equipment Dimension and Weight

 W1000xD1150xH1530mm,965Kg

 Optional

 One person controls more machines、Network SPC（Software only out-line programming   software, UPS continuous power supply)