Low Cost Solder Reflow Oven SMD PCB Laser Soldering Machine

• Windows7 operation interface, powerful functions, easy operation;
• The upper furnace body is opened with electric screw automatic lifting machinery to ensure safety and reliability;
• Equipped with mesh belt tensioning device, stable transportation, no shaking, no deformation, to ensure smooth PCB transportation; synchronous guide rail transmission mechanism (can be connected with the fully automatic placement machine online) to ensure accurate width adjustment and high service life of the guide rail;
• Track automatic control lubrication system, which can automatically lubricate the transmission chain by setting the refueling time and refueling amount;
• All heating zones are PID controlled by computer (the upper and lower temperature zones are independently temperature controlled, and can be opened separately in different temperature zones. Zone heating can be carried out to reduce starting power);
• The network/chain transmission is fully closed-loop controlled by the computer to meet the simultaneous production of different types of PCBs;
• It is equipped with fault sound and light alarm function and leakage protector to ensure the operator and control system Safety;
• Built-in UPS automatic delayed shutdown system to ensure that PCB and reflow soldering machine are not damaged when power is off or overheated;
• Adopting the world's leading small circulation heating method, independent upper and lower hot air small circulation system, uniform temperature, high thermal compensation efficiency, high-efficiency supercharged acceleration air duct, greatly improve the circulation hot air flow, rapid heating (about 20 minutes), high thermal compensation efficiency
• Each temperature zone on the upper and lower layers is equipped with an independent temperature sensing sensor to monitor and compensate the temperature balance of each temperature zone in real time;

Model

ET-R8S

Control PLC and Temperature Control Module

Siemens PLC (Germany)

Computer Control Host & Display

Lenovo

No. Of heating zones

Up 8/ Bottom 8

The length of heating zone

2800MM

No. Of cooling zones

2

The length of cooling zone

Internal 800MM + External 300MM

Transport belt width

450MM

Rail width adjustment range

300MM

PCB size

50-300MM

PCB Height Limit

25mm

Transmission Direction

L-R  (R—L) (Direction Can Be Selected Before Manufacturing)

Mode of transport

Mesh belt+single-lane

Transport connection height

900±20MM

PCB Transport Speed

0～1.8m/min

Temperature control accuracy

±1-2℃(Static)

Temperature control range

Room temperature~300℃ can set

Applicable Solder Types:

Lead-free Solder / Leaded Solder

Temperature Control Method

PID+SSR

Application

CSP、BGA、μBGA、0201chip等单/双面板

Abnormal alarm

Temperature Anomaly (Post-Stabilization Over-Temperature Alarm)

Power Failure Protection

Equipped with a mesh belt mechanical rotation mechanism, effectively preventing PCB damage during sudden power outages.

Power

3Φ、380V、50HZ

Total power

38.5KW

Normal working power consumption

6KW

Starting power

Unstaged starting power:36KW

2-staged starting power: 18KW

Heating Time

Approx.20min  

Dimension

4800*1050*1450±20MM

Weight

1000kg