Automatic Real-Time Defect Detection AOI in SMT Line

• The world's first full-spectrum structured grating using programmable structured grating (PSLM) technology. Compared with traditional fixed glass moiré gratings, software modulation and control of structured gratings are realized. The detection capability and application scope of the equipment are greatly improved. Mechanical wear and maintenance costs are avoided. 100% high-precision three-dimensional measurement of electronic devices and welding conditions in SMT production lines is achieved.
• High-resolution image processing system: 12-megapixel industrial camera, with high-end telecentric lens, supports fast and stable detection of 01005 components. It also provides a variety of detection accuracies such as 10um, 12um, and 15um to meet customers' product diversity and detection speed requirements. Optional high-frame CXP camera solution ensures industry-leading test speed.
• AI intelligent seamless puzzle technology is used to achieve a level that is indistinguishable to the naked eye. This greatly facilitates program creation and debugging, and reduces the possibility of false alarms.
• It adopts an enhanced multi-angle, multi-area, modulatable RGB+W 2D light source design. It is suitable for the inspection of components, solder joints and text in various situations.
• It adopts intelligent program editing method and template-based parameter setting method to facilitate quick program writing and debugging.
• 2D+3D body positioning technology ensures accurate body positioning of special components such as black
• The four-directional projection synchronous structured light technology is used to solve the interference of shadow effects in three-dimensional device detection.
• The repeatability accuracy of the equipment is <<10% (4Sigma).
• Complete SPC analysis software and closed-loop control settings ensure data traceability.

Model

ET-AOIA510

Measurement Principle

Sine white projection PMP inspection

Measurements

Missing Parts,offset,rotation,three-dimensional polarity,upside down,OCV,side standing,tombstone,poor soldering,etc

Detection of Non-performing Types

Solder tip, solder volume percentage,excessive solder, insufficient solder, bridge, hole plugging, solder filet, pad contamination, etc

Lens Resolution

6.5M 13.5μm/16.5μm option；12M 12μm/15μm option

Accuracy

XY (Resolution)：10μm

Repeatability

height：≤1μm （4 Sigma）;volume/area：<1%（4 Sigma）;

Gage R&R

<<10%

Inspection Speed

0.45 SEC/FOV

Quality of Inspection Head

4PCS

Mark-point Detection Time

0.5sec/piece

Maximum Detection Height

15mm

Maximum height of component on PCB

40mm

Maximum measurement height of bent PCB

±5mm

Minimum Component

01005

Maximum Loading PCB & Detection Size(X*Y)

450x450mm

Fixed rail setting

Front rail fixation (rear rail fixation option)

PCB Transfer Direction

Left to right or Right to left

Conveyor Width Adjustment

manual & automatic

Engineering Statistics

SPC:Production Trend；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartee ability Data；AOI Daily/Weekly/Monthly Reports

Gerber & CAD Data Import

support Gerber format（274x,274d),Artificial called the pattern, X/Y import CAD

Operating System Support

Windows 10 Professional （64 bit）

Equipment Dimension and Weight

W1000xD1174xH1550MM, 985Kg

Optional

1D/2D Barcode Scanner; Badmark Function;three-point function;offline programming;Repair Station